Quicken time-to-insight for technical computing

Accelerate design cycles and get products to market faster. [AMD Logo]( [View Online]( [Quicken Time-to-Insight for Technical Workloads⁴]( The First Server Processors to Leverage 3D Die Stacking Discover the performance gains that come with AMD EPYC™ CPUs with AMD 3D V-Cache™ technology: ● Average performance uplift of 88% versus the competition for Ansys® CFX®¹ ● Up to 66% faster performance compared to standard AMD EPYC™ 7003 processors for functional verification on Synopsys® VCS®² ● Average performance uplift of 37% versus the competition for Altair® Radioss™³ [EXPLORE MORE]( Follow Us [Facebook]( [Twitter]( [Instagram]( [Linkedin]( [Youtube]( [Twitch TV]( 1. MLNX-010A: ANSYS® CFX® 2022.1 comparison based on AMD internal testing as of 02/14/2022 measuring the average time to run the cfx_10, cfx_50, cfx_100, cfx_lmans, and cfx_pump test case simulations. Configurations: 2x 32C AMD EPYC™ 7573X with AMD 3D V-Cache technology™ versus 2x 32C Intel Xeon Platinum 8362. Cfx_10 is the max result. Results may vary based on factors including silicon version, hardware and software configuration and driver versions. 2. MLNX-001A: EDA RTL Simulation comparison based on AMD internal testing completed on 9/20/2021 measuring the average time to complete a test case simulation. comparing: 1x 16C EPYC™ 7373X with AMD 3D V-Cache Technology versus 1x 16C AMD EPYC™ 73F3 on the same AMD “Daytona” reference platform. Results may vary based on factors including silicon version, hardware and software configuration and driver versions. 3. MLNX-017: Altair® Radioss® 2021.2 comparison based on AMD internal testing as of 02/14/2022 measuring the time to run the dropsander, neon, and t10m test case simulations Configurations: 2x 32C AMD EPYC 7573X with AMD 3D V-Cache™ versus 2x 32C Intel® Xeon® Platinum 8362. neon is the max result. Results may vary based on factors including silicon version, hardware and software configuration and driver versions. 4. GD-204: “Technical Computing” or “Technical Computing Workloads” as defined by AMD can include: electronic design automation, computational fluid dynamics, finite element analysis, seismic tomography, weather forecasting, quantum mechanics, climate research, molecular modeling, or similar workloads. © 2022 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD Arrow logo, Ryzen, Threadripper, EPYC, Radeon, and combinations thereof, are trademarks of Advanced Micro Devices, Inc. Other product names used in this publication are for identification purposes only and may be trademarks of their respective companies. Advanced Micro Devices, Inc., 2485 Augustine Drive, Santa Clara, CA 95054 USA [AMD Home]( | [Copyright 2022]( | [Privacy]( | [Cookie Policy]( | [Trademarks]( | [Contact Us]( This message is intended for {EMAIL}. This message was sent by AMD. You may at any time update your message [preferences]( or [unsubscribe]( from future mailings.