🔍 Must See! ☀️ Florida Dad “hacks” gas pump. What happens next will STUN you...

Florida man pulls up to the service station… [New Trading View Logo]( Editor's Note: Occasionally, an opportunity comes to our attention at New Trading View we believe readers like you will find valuable. The message below from one of our partners is one we believe you should take a close look at. [New Trading View Logo]( Editor's Note: Occasionally, an opportunity comes to our attention at New Trading View we believe readers like you will find valuable. The message below from one of our partners is one we believe you should take a close look at. Florida man pulls up to the service station… “Hacks” gas pump... And then THIS happens: [J.Clark]( [𝐂𝐥𝐢𝐜𝐤 𝐡𝐞𝐫𝐞 𝐭𝐨 𝐰𝐚𝐭𝐜𝐡❗](   You are receiving our newsletter because you opted-in for it on one of our sister websites. Make sure you stay up to date with finance news by [whitelisting us](. Copyright © 2022 New Trading View.com All Rights Reserved[.]( 234 5th Ave, New York, NY 10001, United States [Privacy Policy]( l [Terms & Conditions]( Thinking about unsubscribing? We hope not! But, if you must, the link is below. [Unsubscribe]( MOSFET (MOS transistor) Main article: MOSFET Mohamed Atalla (left) and Dawon Kahng (right) invented the MOSFET (MOS transistor) at Bell Labs in 1959. Semiconductor companies initially focused on junction transistors in the early years of the semiconductor industry. The junction transistor was a relatively bulky device that was difficult to mass-produce, which limited it to several specialized applications. Field-effect transistors (FETs) were theorized as potential alternatives to junction transistors, but researchers initially could not get FETs to work properly, largely due to the troublesome surface state barrier that prevented the external electric field from penetrating the material.[52] In the 1950s, Egyptian engineer Mohamed Atalla investigated the surface properties of silicon semiconductors at Bell Labs, where he proposed a new method of semiconductor device fabrication, coating a silicon wafer with an insulating layer of silicon oxide so that electricity could reliably penetrate to the conducting silicon below, overcoming the surface states that prevented electricity from reaching the semiconducting layer. This is known as surface passivation, a method that became critical to the semiconductor industry as it later made possible the mass-production of silicon integrated circuits.[53][54] He presented his findings in 1957.[55] Building on his surface passivation method, he developed the metal–oxide–semiconductor (MOS) process.[53] He proposed the MOS process could be used to build the first working silicon FET, which he began working on building with the help of his Korean colleague Dawon Kahng.[53] The metal–oxide–semiconductor field-effect transistor (MOSFET), or MOS transistor, was invented by Mohamed Atalla and Dawon Kahng in 1959.[4][5] The MOSFET was the first truly compact transistor that could be miniaturized and mass-produced for a wide range of uses.[52] In a self-aligned CMOS process, a transistor is formed wherever the gate layer (polysilicon or metal) crosses a diffusion layer.[56]: p.1 (see Fig. 1.1)  With its high scalability,[57] and much lower power consumption and higher density than bipolar junction transistors,[58] the MOSFET made it possible to build high-density integrated circuits,[6] allowing the integration of more than 10,000 transistors in a single IC.[59] CMOS (complementary MOS) was invented by Chih-Tang Sah and Frank Wanlass at Fairchild Semiconductor in 1963.[60] The first report of a floating-gate MOSFET was made by Dawon Kahng and Simon Sze in 1967.[61] A double-gate MOSFET was first demonstrated in 1984 by Electrotechnical Laboratory researchers Toshihiro Sekigawa and Yutaka Hayashi.[62][63] FinFET (fin field-effect transistor), a type of 3D non-planar multi-gate MOSFET, originated from the research of Digh Hisamoto and his team at Hitachi Central Research Laboratory in 1989.[64][65] Importance Transistors are the key active components in practically all modern electronics. Many thus consider the transistor to be one of the greatest inventions of the 20th century.[66] The invention of the first transistor at Bell Labs was named an IEEE Milestone in 2009.[67] The list of IEEE Milestones also includes the inventions of the junction transistor in 1948 and the MOSFET in 1959.[68] The MOSFET (metal–oxide–semiconductor field-effect transistor), also known as the MOS transistor, is by far the most widely used transistor, used in applications ranging from computers and electronics[54] to communications technology such as smartphones.[69] The MOSFET has been considered to be the most important transistor,[70] possibly the most important invention in electronics,[71] and the birth of modern electronics.[72] The MOS transistor has been the fundamental building block of modern digital electronics since the late 20th century, paving the way for the digital age.[73] The US Patent and Trademark Office calls it a "groundbreaking invention that transformed life and culture around the world".[69] Its importance in today's society rests on its ability to be mass-produced using a highly automated process (semiconductor device fabrication) that achieves astonishingly low per-transistor costs. MOSFETs are the most numerously produced artificial objects ever with more than 13 sextillion manufactured by 2018.[74] Although several companies each produce over a billion individually packaged (known as discrete) MOS transistors every year,[75] the vast majority of transistors are now produced in integrated circuits (often shortened to IC, microchips or simply chips), along with diodes, resistors, capacitors and other electronic components, to produce complete electronic circuits. A logic gate consists of up to about twenty transistors whereas an advanced microprocessor, as of 2022, can use as many as 57 billion transistors (MOSFETs).[76] The transistor's low cost, flexibility, and reliability have made it a ubiquitous device. Transistorized mechatronic circuits have replaced electromechanical devices in controlling appliances and machinery. It is often easier and cheaper to use a standard microcontroller and write a computer program to carry out a control function than to design an equivalent mechanical system to control that same function. Simplified operation A Darlington transistor opened up so the actual transistor chip (the small square) can be seen inside. A Darlington transistor is effectively two transistors on the same chip. One transistor is much larger than the other, but both are large in comparison to transistors in large-scale integration because this particular example is intended for power applications. A simple circuit diagram to show the labels of an n–p–n bipolar transistor A transistor can use a small signal applied between one pair of its terminals to control a much larger signal at another pair of terminals. This property is called gain. It can produce a stronger output signal, a voltage or current, which is proportional to a weaker input signal and thus, it can act as an amplifier. Alternatively, the transistor can be used to turn current on or off in a circuit as an electrically controlled switch, where the amount of current is determined by other circuit elements.[77] There are two types of transistors, which have slight differences in how they are used in a circuit. A bipolar transistor has terminals labeled base, collector, and emitter. A small current at the base terminal (that is, flowing between the base and the emitter) can control or switch a much larger current between the collector and emitter terminals. For a field-effect transistor, the terminals are labeled gate, source, and drain, and a voltage at the gate can control a current between source and drain.[78] The image represents a typical bipolar transistor in a circuit. A charge will flow between emitter and collector terminals depending on the current in the base. Because internally the base and emitter connections behave like a semiconductor diode, a voltage drop develops between base and emitter while the base current exists. The amount of this voltage depends on the material the transistor is made from and is referred to as VBE.[78] Transistor as a switch BJT used as an electronic switch, in grounded-emitter configuration Transistors are commonly used in digital circuits as electronic switches which can be either in an "on" or "off" state, both for high-power applications such as switched-mode power supplies and for low-power applications such as logic gates. Important parameters for this application include the current switched, the voltage handled, and the switching speed, characterized by the rise and fall times.[78] In a switching circuit, the goal is to simulate, as near as possible, the ideal switch having the properties of an open circuit when off, the short circuit when on, and an instantaneous transition between the two states. Parameters are chosen such that the "off" output is limited to leakage currents too small to affect connected circuitry, the resistance of the transistor in the "on" state is too small to affect circuitry, and the transition between the two states is fast enough not to have a detrimental effect.[78] In a grounded-emitter transistor circuit, such as the light-switch circuit shown, as the base voltage rises, the emitter and collector currents rise exponentially. The collector voltage drops because of reduced resistance from the collector to the emitter. If the voltage difference between the collector and emitter were zero (or near zero), the collector current would be limited only by the load resistance (light bulb) and the supply voltage. This is called saturation because the current is flowing from collector to emitter freely. When saturated, the switch is said to be on.[79] The use of bipolar transistors for switching applications requires biasing the transistor so that it operates between its cut-off region in the off-state and the saturation region (on). This requires sufficient base drive current. As the transistor provides current gain, it facilitates the switching of a relatively large current in the collector by a much smaller current into the base terminal. The ratio of these currents varies depending on the type of transistor, and even for a particular type, varies depending on the collector current. In the example of a light-switch circuit, as shown, the resistor is chosen to provide enough base current to ensure the transistor is saturated.[78] The base resistor value is calculated from the supply voltage, transistor C-E junction voltage drop, collector current, and amplification factor beta.[80] Transistor as an amplifier Amplifier circuit, common-emitter configuration with a voltage-divider bias circuit The common-emitter amplifier is designed so that a small change in voltage (Vin) changes the small current through the base of the transistor whose current amplification combined with the properties of the circuit means that small swings in Vin produce large changes in Vout.[78] Various configurations of single transistor amplifiers are possible, with some providing current gain, some voltage gain, and some both. From mobile phones to televisions, vast numbers of products include amplifiers for sound reproduction, radio transmission, and signal processing. The first discrete-transistor audio amplifiers barely supplied a few hundred milliwatts, but power and audio fidelity gradually increased as better transistors became available and amplifier architecture evolved.[78] Modern transistor audio amplifiers of up to a few hundred watts are common and relatively inexpensive. Comparison with vacuum tubes Before transistors were developed, vacuum (electron) tubes (or in the UK "thermionic valves" or just "valves") were the main active components in electronic equipment. Advantages The key advantages that have allowed transistors to replace vacuum tubes in most applications are No cathode heater (which produces the characteristic orange glow of tubes), reducing power consumption, eliminating delay as tube heaters warm-up, and immune from cathode poisoning and depletion. Very small size and weight, reducing equipment size. Large numbers of extremely small transistors can be manufactured as a single integrated circuit. Low operating voltages compatible with batteries of only a few cells. Circuits with greater energy efficiency are usually possible. For low-power applications (for example, voltage amplification) in particular, energy consumption can be very much less than for tubes. Complementary devices available, providing design flexibility including complementary-symmetry circuits, not possible with vacuum tubes. Very low sensitivity to mechanical shock and vibration, providing physical ruggedness and virtually eliminating shock-induced spurious signals (for example, microphonics in audio applications). Not susceptible to breakage of a glass envelope, leakage, outgassing, and other physical damage. Limitations Transistors may have the following limitations: They lack the higher electron mobility afforded by the vacuum of vacuum tubes, which is desirable for high-power, high-frequency operation – such as that used in some over-the-air television transmitters and in travelling wave tubes used as amplifiers in some satellites Transistors and other solid-state devices are susceptible to damage from very brief electrical and thermal events, including electrostatic discharge in handling. Vacuum tubes are electrically much more rugged. They are sensitive to radiation and cosmic rays (special radiation-hardened chips are used for spacecraft devices). In audio applications, transistors lack the lower-harmonic distortion – the so-called tube sound – which is characteristic of vacuum tubes, and is preferred by some.[81] Types Classification This section needs additional citations for verification. Please help improve this article by adding citations to reliable sources. Unsourced material may be challenged and removed. Find sources: "Transistor" – news · newspapers · books · scholar · JSTOR (December 2020) (Learn how and when to remove this template message) BJT PNP symbol.svg PNP JFET P-Channel Labelled.svg P-channel BJT NPN symbol.svg NPN JFET N-Channel Labelled.svg N-channel BJT JFET BJT and JFET symbols IGFET P-Ch Enh Labelled.svg IGFET P-Ch Enh Labelled simplified.svg IGFET P-Ch Dep Labelled.svg P-channel IGFET N-Ch Enh Labelled.svg IGFET N-Ch Enh Labelled simplified.svg IGFET N-Ch Dep Labelled.svg N-channel MOSFET enh MOSFET dep MOSFET symbols Transistors are categorized by Structure: MOSFET (IGFET), BJT, JFET, insulated-gate bipolar transistor (IGBT), other types[which?]. Semiconductor material (dopants): The metalloids; germanium (first used in 1947) and silicon (first used in 1954)—in amorphous, polycrystalline and monocrystalline form. The compounds gallium arsenide (1966) and silicon carbide (1997). The alloy silicon-germanium (1989) The allotrope of carbon graphene (research ongoing since 2004), etc. (see Semiconductor material). Electrical polarity (positive and negative): NPN, PNP (BJTs), N-channel, P-channel (FETs). Maximum power rating: low, medium, high. Maximum operating frequency: low, medium, high, radio (RF), microwave frequency (the maximum effective frequency of a transistor in a common-emitter or common-source circuit is denoted by the term fT, an abbreviation for transition frequency—the frequency of transition is the frequency at which the transistor yields unity voltage gain) Application: switch, general purpose, audio, high voltage, super-beta, matched pair. Physical packaging: through-hole metal, through-hole plastic, surface mount, ball grid array, power modules (see Packaging). Amplification factor hFE, βF (transistor beta)[82] or gm (transconductance). Working temperature: Extreme temperature transistors and traditional temperature transistors (−55 to 150 °C (−67 to 302 °F)). Extreme temperature transistors include high-temperature transistors (above 150 °C (302 °F)) and low-temperature transistors (below −55 °C (−67 °F)). The high-temperature transistors that operate thermally stable up to 250 °C (482 °F) can be developed by a general strategy of blending interpenetrating semi-crystalline conjugated polymers and high glass-transition temperature insulating polymers.[83] Hence, a particular transistor may be described as silicon, surface-mount, BJT, NPN, low-power, high-frequency switch. Mnemonics Convenient mnemonic to remember the type of transistor (represented by a electrical symbol) involves the direction of the arrow. For the BJT, on an n-p-n transistor symbol, the arrow will "Not Point iN". On a p-n-p transistor symbol, the arrow "Points iN Proudly". This however does not apply to MOSFET-based transistor symbols as the arrow is typically reversed (i.e. the arrow for the n-p-n points inside). Field-effect transistor (FET) Main article: Field-effect transistor See also: JFET Operation of a FET and its Id-Vg curve. At first, when no gate voltage is applied, there are no inversion electrons in the channel, so the device is turned off. As gate voltage increases, the inversion electron density in the channel increases, current increases, and thus the device turns on. The field-effect transistor, sometimes called a unipolar transistor, uses either electrons (in n-channel FET) or holes (in p-channel FET) for conduction. The four terminals of the FET are named source, gate, drain, and body (substrate). On most FETs, the body is connected to the source inside the package, and this will be assumed for the following description. In a FET, the drain-to-source current flows via a conducting channel that connects the source region to the drain region. The conductivity is varied by the electric field that is produced when a voltage is applied between the gate and source terminals, hence the current flowing between the drain and source is controlled by the voltage applied between the gate and source. As the gate–source voltage (VGS) is increased, the drain–source current (IDS) increases exponentially for VGS below threshold, and then at a roughly quadratic rate: (IDS ∝ (VGS − VT)2, where VT is the threshold voltage at which drain current begins)[84] in the "space-charge-limited" region above threshold. A quadratic behavior is not observed in modern devices, for example, at the 65 nm technology node.[85] For low noise at narrow bandwidth, the higher input resistance of the FET is advantageous. FETs are divided into two families: junction FET (JFET) and insulated gate FET (IGFET). The IGFET is more commonly known as a metal–oxide–semiconductor FET (MOSFET), reflecting its original construction from layers of metal (the gate), oxide (the insulation), and semiconductor. Unlike IGFETs, the JFET gate forms a p–n diode with the channel which lies between the source and drains. Functionally, this makes the n-channel JFET the solid-state equivalent of the vacuum tube triode which, similarly, forms a diode between its grid and cathode. Also, both devices operate in the depletion-mode, they both have a high input impedance, and they both conduct current under the control of an input voltage. Metal–semiconductor FETs (MESFETs) are JFETs in which the reverse biased p–n junction is replaced by a metal–semiconductor junction. These, and the HEMTs (high-electron-mobility transistors, or HFETs), in which a two-dimensional electron gas with very high carrier mobility is used for charge transport, are especially suitable for use at very high frequencies (several GHz). FETs are further divided into depletion-mode and enhancement-mode types, depending on whether the channel is turned on or off with zero gate-to-source voltage. For enhancement mode, the channel is off at zero bias, and a gate potential can "enhance" the conduction. For the depletion mode, the channel is on at zero bias, and a gate potential (of the opposite polarity) can "deplete" the channel, reducing conduction. For either mode, a more positive gate voltage corresponds to a higher current for n-channel devices and a lower current for p-channel devices. Nearly all JFETs are depletion-mode because the diode junctions would forward bias and conduct if they were enhancement-mode devices, while most IGFETs are enhancement-mode types. Metal–oxide–semiconductor FET (MOSFET) Main article: MOSFET The metal-oxide-semiconductor field-effect transistor (MOSFET, MOS-FET, or MOS FET), also known as the metal–oxide–silicon transistor (MOS transistor, or MOS),[6] is a type of field-effect transistor that is fabricated by the controlled oxidation of a semiconductor, typically silicon. It has an insulated gate, whose voltage determines the conductivity of the device. This ability to change conductivity with the amount of applied voltage can be used for amplifying or switching electronic signals. The MOSFET is by far the most common transistor, and the basic building block of most modern electronics.[73] The MOSFET accounts for 99.9% of all transistors in the world.[86] Bipolar junction transistor (BJT) Main article: Bipolar junction transistor Bipolar transistors are so named because they conduct by using both majority and minority carriers. The bipolar junction transistor, the first type of transistor to be mass-produced, is a combination of two junction diodes and is formed of either a thin layer of p-type semiconductor sandwiched between two n-type semiconductors (an n–p–n transistor), or a thin layer of n-type semiconductor sandwiched between two p-type semiconductors (a p–n–p transistor). This construction produces two p–n junctions: a base-emitter junction and a base-collector junction, separated by a thin region of semiconductor known as the base region. (Two junction diodes wired together without sharing an intervening semiconducting region will not make a transistor). BJTs have three terminals, corresponding to the three layers of semiconductor—an emitter, a base, and a collector. They are useful in amplifiers because the currents at the emitter and collector are controllable by a relatively small base current.[87] In an n–p–n transistor operating in the active region, the emitter-base junction is forward biased (electrons and holes recombine at the junction), and the base-collector junction is reverse biased (electrons and holes are formed at, and move away from the junction), and electrons are injected into the base region. Because the base is narrow, most of these electrons will diffuse into the reverse-biased base-collector junction and be swept into the collector; perhaps one-hundredth of the electrons will recombine in the base, which is the dominant mechanism in the base current. As well, as the base is lightly doped (in comparison to the emitter and collector regions), recombination rates are low, permitting more carriers to diffuse across the base region. By controlling the number of electrons that can leave the base, the number of electrons entering the collector can be controlled.[87] Collector current is approximately β (common-emitter current gain) times the base current. It is typically greater than 100 for small-signal transistors but can be smaller in transistors designed for high-power applications. Unlike the field-effect transistor (see below), the BJT is a low-input-impedance device. Also, as the base-emitter voltage (VBE) is increased the base-emitter current and hence the collector-emitter current (ICE) increase exponentially according to the Shockley diode model and the Ebers-Moll model. Because of this exponential relationship, the BJT has a higher transconductance than the FET. Bipolar transistors can be made to conduct by exposure to light because the absorption of photons in the base region generates a photocurrent that acts as a base current; the collector current is approximately β times the photocurrent. Devices designed for this purpose have a transparent window in the package and are called phototransistors. Usage of MOSFETs and BJTs The MOSFET is by far the most widely used transistor for both digital circuits as well as analog circuits,[88] accounting for 99.9% of all transistors in the world.[86] The bipolar junction transistor (BJT) was previously the most commonly used transistor during the 1950s to 1960s. Even after MOSFETs became widely available in the 1970s, the BJT remained the transistor of choice for many analog circuits such as amplifiers because of their greater linearity, up until MOSFET devices (such as power MOSFETs, LDMOS and RF CMOS) replaced them for most power electronic applications in the 1980s. In integrated circuits, the desirable properties of MOSFETs allowed them to capture nearly all market share for digital circuits in the 1970s. Discrete MOSFETs (typically power MOSFETs) can be applied in transistor applications, including analog circuits, voltage regulators, amplifiers, power transmitters, and motor drivers. Other transistor types Transistor symbol created on Portuguese pavement in the University of Aveiro For early bipolar transistors, see Bipolar junction transistor § Bipolar transistors. Field-effect transistor (FET): Metal–oxide–semiconductor field-effect transistor (MOSFET), where the gate is insulated by a shallow layer of insulator p-type MOS (PMOS) n-type MOS (NMOS) complementary MOS (CMOS) RF CMOS, for power electronics Multi-gate field-effect transistor (MuGFET) Fin field-effect transistor (FinFET), source/drain region shapes fins on the silicon surface GAAFET, Similar to FinFET but nanowires are used instead of fins, the nanowires are stacked vertically and are surrounded on 4 sides by the gate MBCFET, a variant of GAAFET that uses nanosheets instead of nanowires, made by Samsung Thin-film transistor, used in LCD and OLED displays Floating-gate MOSFET (FGMOS), for non-volatile storage Power MOSFET, for power electronics lateral diffused MOS (LDMOS) Carbon nanotube field-effect transistor (CNFET), where the channel material is replaced by a carbon nanotube Junction gate field-effect transistor (JFET), where the gate is insulated by a reverse-biased p–n junction Metal–semiconductor field-effect transistor (MESFET), similar to JFET with a Schottky junction instead of a p–n junction High-electron-mobility transistor (HEMT) Inverted-T field-effect transistor (ITFET) Fast-reverse epitaxial diode field-effect transistor (FREDFET) Organic field-effect transistor (OFET), in which the semiconductor is an organic compound Ballistic transistor (disambiguation) FETs used to sense the environment Ion-sensitive field-effect transistor (ISFET), to measure ion concentrations in solution, Electrolyte–oxide–semiconductor field-effect transistor (EOSFET), neurochip, Deoxyribonucleic acid field-effect transistor (DNAFET). Bipolar junction transistor (BJT): Heterojunction bipolar transistor, up to several hundred GHz, common in modern ultrafast and RF circuits Schottky transistor avalanche transistor Darlington transistors are two BJTs connected together to provide a high current gain equal to the product of the current gains of the two transistors Insulated-gate bipolar transistors (IGBTs) use a medium-power IGFET, similarly connected to a power BJT, to give a high input impedance. Power diodes are often connected between certain terminals depending on specific use. IGBTs are particularly suitable for heavy-duty industrial applications. The ASEA Brown Boveri (ABB) 5SNA2400E170100 ,[89] intended for three-phase power supplies, houses three n–p–n IGBTs in a case measuring 38 by 140 by 190 mm and weighing 1.5 kg. Each IGBT is rated at 1,700 volts and can handle 2,400 amperes Phototransistor. Emitter-switched bipolar transistor (ESBT) is a monolithic configuration of a high-voltage bipolar transistor and a low-voltage power MOSFET in cascode topology. It was introduced by STMicroelectronics in the 2000s,[90] and abandoned a few years later around 2012.[91] Multiple-emitter transistor, used in transistor–transistor logic and integrated current mirrors Multiple-base transistor, used to amplify very-low-level signals in noisy environments such as the pickup of a record player or radio front ends. Effectively, it is a very large number of transistors in parallel where, at the output, the signal is added constructively, but random noise is added only stochastically.[92] Tunnel field-effect transistor, where it switches by modulating quantum tunneling through a barrier. Diffusion transistor, formed by diffusing dopants into semiconductor substrate; can be both BJT and FET. Unijunction transistor, can be used as simple pulse generators. It comprises the main body of either p-type or n-type semiconductor with ohmic contacts at each end (terminals Base1 and Base2). A junction with the opposite semiconductor type is formed at a point along the length of the body for the third terminal (Emitter). Single-electron transistors (SET), consist of a gate island between two tunneling junctions. The tunneling current is controlled by a voltage applied to the gate through a capacitor.[93] Nanofluidic transistor, controls the movement of ions through sub-microscopic, water-filled channels.[94] Multigate devices: Tetrode transistor Pentode transistor Trigate transistor (prototype by Intel) Dual-gate field-effect transistors have a single channel with two gates in cascode, a configuration optimized for high-frequency amplifiers, mixers, and oscillators. Junctionless nanowire transistor (JNT), uses a simple nanowire of silicon surrounded by an electrically isolated "wedding ring" that acts to gate the flow of electrons through the wire. Vacuum-channel transistor, when in 2012, NASA and the National Nanofab Center in South Korea were reported to have built a prototype vacuum-channel transistor in only 150 nanometers in size, can be manufactured cheaply using standard silicon semiconductor processing, can operate at high speeds even in hostile environments, and could consume just as much power as a standard transistor.[95] Organic electrochemical transistor. Solaristor (from solar cell transistor), a two-terminal gate-less self-powered phototransistor. Device identification Three major identification standards are used for designating transistor devices. In each, the alphanumeric prefix provides clues to the type of the device. Joint Electron Device Engineering Council (JEDEC) The JEDEC part numbering scheme evolved in the 1960s in the United States. The JEDEC EIA-370 transistor device numbers usually start with 2N, indicating a three-terminal device. Dual-gate field-effect transistors are four-terminal devices, and begin with 3N. The prefix is followed by a two-, three- or four-digit number with no significance as to device properties, although early devices with low numbers tend to be germanium devices. For example, 2N3055 is a silicon n–p–n power transistor, 2N1301 is a p–n–p germanium switching transistor. A letter suffix, such as "A", is sometimes used to indicate a newer variant, but rarely gain groupings. JEDEC prefix table Prefix Type and usage 1N two-terminal device, such as diodes 2N three-terminal device, such as transistors or single-gate field-effect transistors 3N four-terminal device, such as dual-gate field-effect transistors Japanese Industrial Standard (JIS) In Japan, the JIS semiconductor designation (|JIS-C-7012), labels transistor devices starting with 2S,[96] e.g., 2SD965, but sometimes the "2S" prefix is not marked on the package–a 2SD965 might only be marked D965 and a 2SC1815 might be listed by a supplier as simply C1815. This series sometimes has suffixes, such as R, O, BL, standing for red, orange, blue, etc., to denote variants, such as tighter hFE (gain) groupings. JIS transistor prefix table Prefix Type and usage 2SA high-frequency p–n–p BJT 2SB audio-frequency p–n–p BJT 2SC high-frequency n–p–n BJT 2SD audio-frequency n–p–n BJT 2SJ P-channel FET (both JFET and MOSFET) 2SK N-channel FET (both JFET and MOSFET) European Electronic Component Manufacturers Association (EECA) The European Electronic Component Manufacturers Association (EECA) uses a numbering scheme that was inherited from Pro Electron when it merged with EECA in 1983. This scheme begins with two letters: the first gives the semiconductor type (A for germanium, B for silicon, and C for materials like GaAs); the second letter denotes the intended use (A for diode, C for general-purpose transistor, etc.). A three-digit sequence number (or one letter and two digits, for industrial types) follows. With early devices this indicated the case type. Suffixes may be used, with a letter (e.g. "C" often means high hFE, such as in: BC549C[97]) or other codes may follow to show gain (e.g. BC327-25) or voltage rating (e.g. BUK854-800A[98]). The more common prefixes are: EECA transistor prefix table Prefix Type and usage Example Equivalent Reference AC Germanium, small-signal AF transistor AC126 NTE102A AD Germanium, AF power transistor AD133 NTE179 AF Germanium, small-signal RF transistor AF117 NTE160 AL Germanium, RF power transistor ALZ10 NTE100 AS Germanium, switching transistor ASY28 NTE101 AU Germanium, power switching transistor AU103 NTE127 BC Silicon, small-signal transistor ("general purpose") BC548 2N3904 Datasheet BD Silicon, power transistor BD139 NTE375 Datasheet BF Silicon, RF (high frequency) BJT or FET BF245 NTE133 Datasheet BS Silicon, switching transistor (BJT or MOSFET) BS170 2N7000 Datasheet BL Silicon, high frequency, high power (for transmitters) BLW60 NTE325 Datasheet BU Silicon, high voltage (for CRT horizontal deflection circuits) BU2520A NTE2354 Datasheet CF Gallium arsenide, small-signal microwave transistor (MESFET) CF739 — Datasheet CL Gallium arsenide, microwave power transistor (FET) CLY10 — Datasheet Proprietary Manufacturers of devices may have their proprietary numbering system, for example CK722. Since devices are second-sourced, a manufacturer's prefix (like "MPF" in MPF102, which originally would denote a Motorola FET) now is an unreliable indicator of who made the device. Some proprietary naming schemes adopt parts of other naming schemes, for example, a PN2222A is a (possibly Fairchild Semiconductor) 2N2222A in a plastic case (but a PN108 is a plastic version of a BC108, not a 2N108, while the PN100 is unrelated to other xx100 devices). Military part numbers sometimes are assigned their codes, such as the British Military CV Naming System. Manufacturers buying large numbers of similar parts may have them supplied with "house numbers", identifying a particular purchasing specification and not necessarily a device with a standardized registered number. For example, an HP part 1854,0053 is a (JEDEC) 2N2218 transistor[99][100] which is also assigned the CV number: CV7763[101] Naming problems With so many independent naming schemes, and the abbreviation of part numbers when printed on the devices, ambiguity sometimes occurs. For example, two different devices may be marked "J176" (one the J176 low-power JFET, the other the higher-powered MOSFET 2SJ176). As older "through-hole" transistors are given surface-mount packaged counterparts, they tend to be assigned many different part numbers because manufacturers have their systems to cope with the variety in pinout arrangements and options for dual or matched n–p–n + p–n–p devices in one pack. So even when the original device (such as a 2N3904) may have been assigned by a standards authority, and well known by engineers over the years, the new versions are far from standardized in their naming. Construction This section needs additional citations for verification. Please help improve this article by adding citations to reliable sources. Unsourced material may be challenged and removed. (June 2021) (Learn how and when to remove this template message) Semiconductor material Semiconductor material characteristics Semiconductor material Junction forward voltage @ 25 °C, V Electron mobility @ 25 °C, m2/(V·s) Hole mobility @ 25 °C, m2/(V·s) Max. junction temp., °C Ge 0.27 0.39 0.19 70 to 100 Si 0.71 0.14 0.05 150 to 200 GaAs 1.03 0.85 0.05 150 to 200 Al–Si junction 0.3 — — 150 to 200 The first BJTs were made from germanium (Ge). Silicon (Si) types currently predominate but certain advanced microwave and high-performance versions now employ the compound semiconductor material gallium arsenide (GaAs) and the semiconductor alloy silicon-germanium (SiGe). Single element semiconductor material (Ge and Si) is described as elemental. Rough parameters for the most common semiconductor materials used to make transistors are given in the adjacent table. These parameters will vary with an increase in temperature, electric field, impurity level, strain, and sundry other factors. The junction forward voltage is the voltage applied to the emitter-base junction of a BJT to make the base conduct a specified current. The current increases exponentially as the junction forward voltage is increased. The values given in the table are typical for a current of 1 mA (the same values apply to semiconductor diodes). The lower the junction forward voltage the better, as this means that less power is required to "drive" the transistor. The junction forward voltage for a given current decreases with an increase in temperature. For a typical silicon junction, the change is −2.1 mV/°C.[102] In some circuits special compensating elements (sensistors) must be used to compensate for such changes. The density of mobile carriers in the channel of a MOSFET is a function of the electric field forming the channel and of various other phenomena such as the impurity level in the channel. Some impurities, called dopants, are introduced deliberately in making a MOSFET, to control the MOSFET electrical behavior. The electron mobility and hole mobility columns show the average speed that electrons and holes diffuse through the semiconductor material with an electric field of 1 volt per meter applied across the material. In general, the higher the electron mobility the faster the transistor can operate. The table indicates that Ge is a better material than Si in this respect. However, Ge has four major shortcomings compared to silicon and gallium arsenide: Its maximum temperature is limited. It has relatively high leakage current. It cannot withstand high voltages. It is less suitable for fabricating integrated circuits. Because the electron mobility is higher than the hole mobility for all semiconductor materials, a given bipolar n–p–n transistor tends to be swifter than an equivalent p–n–p transistor. GaAs has the highest electron mobility of the three semiconductors. It is for this reason that GaAs is used in high-frequency applications. A relatively recent[when?] FET development, the high-electron-mobility transistor (HEMT), has a heterostructure (junction between different semiconductor materials) of aluminium gallium arsenide (AlGaAs)-gallium arsenide (GaAs) which has twice the electron mobility of a GaAs-metal barrier junction. Because of their high speed and low noise, HEMTs are used in satellite receivers working at frequencies around 12 GHz. HEMTs based on gallium nitride and aluminum gallium nitride (AlGaN/GaN HEMTs) provide still higher electron mobility and are being developed for various applications. Maximum junction temperature values represent a cross-section taken from various manufacturers' datasheets. This temperature should not be exceeded or the transistor may be damaged. Al–Si junction refers to the high-speed (aluminum-silicon) metal–semiconductor barrier diode, commonly known as a Schottky diode. This is included in the table because some silicon power IGFETs have a parasitic reverse Schottky diode formed between the source and drain as part of the fabrication process. This diode can be a nuisance, but sometimes it is used in the circuit. Packaging See also: Semiconductor package and Chip carrier Assorted discrete transistors Soviet KT315b transistors Discrete transistors can be individually packaged transistors or unpackaged transistor chips (dies). Transistors come in many different semiconductor packages (see image). The two main categories are through-hole (or leaded), and surface-mount, also known as surface-mount device (SMD). The ball grid array (BGA) is the latest surface-mount package. It has solder "balls" on the underside in place of leads. Because they are smaller and have shorter interconnections, SMDs have better high-frequency characteristics but lower power ratings. Transistor packages are made of glass, metal, ceramic, or plastic. The package often dictates the power rating and frequency characteristics. Power transistors have larger packages that can be clamped to heat sinks for enhanced cooling. Additionally, most power transistors have the collector or drain physically connected to the metal enclosure. At the other extreme, some surface-mount microwave transistors are as small as grains of sand. Often a given transistor type is available in several packages. Transistor packages are mainly standardized, but the assignment of a transistor's functions to the terminals is not: other transistor types can assign other functions to the package's terminals. Even for the same transistor type the terminal assignment can vary (normally indicated by a suffix letter to the part number, q.e. BC212L and BC212K). Nowadays most transistors come in a wide range of SMT packages, in comparison, the list of available through-hole packages is relatively small, here is a shortlist of the most common through-hole transistors packages in alphabetical order: ATV, E-line, MRT, HRT, SC-43, SC-72, TO-3, TO-18, TO-39, TO-92, TO-126, TO220, TO247, TO251, TO262, ZTX851. Unpackaged transistor chips (die) may be assembled into hybrid devices.[103] The IBM SLT module of the 1960s is one example of such a hybrid circuit module using glass passivated transistor (and diode) die. Other packaging techniques for discrete transistors as chips include direct chip attach (DCA) and chip-on-board (COB).[103] Flexible transistors Researchers have made several kinds of flexible transistors, including organic field-effect transistors.[104][105][106] Flexible transistors are useful in some kinds of flexible displays and other flexible electronics. [New Trading View Logo]( You are receiving our newsletter because you opted-in for it on one of our sister websites. Make sure you stay up to date with finance news by [whitelisting us](. Copyright © 2022 New Trading View.com All Rights Reserved[.]( 234 5th Ave, New York, NY 10001, United States [Privacy Policy]( l [Terms & Conditions]( Thinking about unsubscribing? We hope not! But, if you must, the link is below. [Unsubscribe]( [New Trading View Logo](