Digest Edition: Upcoming and On-Demand Webinars

System Level Thermal Design of Complex Multi-Layer Printed Circuit Boards [View web version]( 30 January 2023 — Issue 1 | Vol 4 [Webinar Monthly Digest - Engineering360] [Webinar Monthly Digest - Engineering360] [Source Products]( | [Webinar Library]( | [Standards]( On-Demand Webinars [Integrated Test Solutions for 5G, Data Centers and High-Speed Test Applications]( from Smiths Interconnect Attendees will learn about the rapid expansion of connected devices and data-intensive applications that is driving the growing demand for highly efficient and adaptive high-performance computing solutions. [Tune in, tech out, and design more]( [Tune in, tech out, and design more]( from Mouser Electronics Explore innovation together with Mouser by listening to all our [latest podcasts](. Take deep dives into the newest design trends and solutions with the industry’s leading engineering minds. [Solving for Multiple Design Challenges with a Single Connection]( from TE Connectivity™ Attendees will learn how TE Connectivity's portfolio of connectors and heat shrink tubing products address the challenges engineers face when it comes to harsh environments, ergonomically friendly products, and safety standards. [Simulation Driven Design for Electronics]( from Siemens Digital Industries Software As a business leader, we know how vitally important it is for you to deliver the products your customers expect; there's so much at stake and many risks. The problem is that design teams can't keep up with all the product requirements changes and updates because they don't have the tools to see the impact of the changes, and they can't adapt and validate them fast enough. But that whole mess can be avoided by getting a high-level view of design performance using simulation and analysis earlier and often in the design process. The goal is to resolve problems early before they become significant. [Choosing the Right Display for Your Product]( from Azumo When developing a product that requires a display, choosing the right display is key. But how do you select the right display for your application? In this webinar, Azumo discusses five different display technologies and analyzes 10 key considerations to help you decide the best display for your product. [Creating an Industrial Bridge: Moving Seamlessly Between Wired and Wireless Worlds]( from Richardson RFPD Attendees will learn how to securely bridge applications and solutions from the wired world to the wireless. [Next Generation CCUS Technologies and Disruptive Valve Actuation]( from Rotork plc This presentation aims to provide understanding of the relevant needs of this emerging market and how one form of actuation is presenting itself as a strategic progressive and disruptive solution. [Custom Grid Array: High-Density, Robust and Cost-Effective RF Performance for Medical Devices]( from Smiths Interconnect This webinar will discuss the current and emerging trends of miniaturization and more cost-effective solutions, and how this can be addressed using alternatives to traditional coax solutions. [Developing Optimized End-to-End Liquid Cooling Systems]( from Boyd Corporation Attendees will see design and manufacturing considerations for the development of highly efficient liquid cooling systems that fit design constraints while improving system performance and reliability. [Metal 3D Printing for Service Bureaus and Machine Shops]( from Desktop Metal Watch this webinar presentation to learn how metal 3D printing is helping machine shops and service bureaus optimize their operations by offering customers faster lead times and more design freedoms. [Shunt Resistors: New Approaches Obtain Higher Accuracy, Higher Power Density, More Robustness]( from Isabellenhutte USA In this webinar we will discuss new developments in the design and application of shunt resistors. Shunts are a widely used technology for current measurement. Future demands require more accuracy, higher-power densities and more robustness. We present new designs and application examples to make use of these. Upcoming Webinars [System Level Thermal Design of Complex Multi-Layer Printed Circuit Boards]( from Siemens Digital Industries Software, Inc. — January 31, 2023 1:00PM EDT This webinar aims to demonstrate how a combined electro-thermal co-simulation as well as thermo-mechanical analyses of these boards using Siemens Simcenter products can improve the accuracy of the analyses and increase the productivity of the design teams. [Get to your 'AHA' Moment Quicker with Advanced Eye Analysis]( from Rohde & Schwarz GmbH & Co. KG — February 02, 2023 9:00AM EDT Attendees will see how Rohde & Schwarz has developed a novel way of capturing and measuring eye diagrams in hardware. [A Tutorial on Thermogravimetric Analysis (TGA)]( from METTLER TOLEDO Thermal Analysis — February 03, 2023 10:00AM EDT Attendees will learn the advantages of using different temperature programs and understand the most important industrial TGA applications. [A Model-Based System Engineering Approach to Advanced Semiconductor Package Design]( from Siemens Digital Industries Software — February 09, 2023 11:00AM EDT Semiconductor companies looking at new, system-level approaches to keep up with Moore's law and design complexity must adopt a model-based system engineering approach that emphasizes an integrated product design workflow for advanced semiconductor packaging design with a collaborative PLM platform, including NX, Simcenter FloEFD, Simcenter 3D, Simcenter HEEDS and Simcenter T3Ster. Garrett Wyatt is a New Business Sales Executive for Siemens Digital Industries Software who works with industry-leading semiconductor companies to select the best tools and design methodologies. [Automate Your Factory Floor Through a Single Digital Manufacturing Automation Platform]( from Vention — February 14, 2023 10:00AM EDT Join this webinar to learn more about Vention's MAP and its new addition, the digital twin, MachineCloud. Connect with us: [Facebook]( [Twitter]( [Linkedin]( Feedback on this issue? [Tell us what you think]( Join our team of [Expert Contributors]( Engineering360 publishes more than 60 free industry newsletters - [browse our portfolio](. Want to reach industry executives with your message? [Download our media kit]( or contact us directly at sales@globalspec.com. About this email: You are receiving this message as part of your complimentary newsletter subscription to Webinar Monthly Digest. 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