Digest Edition: Upcoming and On-Demand Webinars

Simulation Driven Design for Electronics [View web version]( 26 December 2022 — Issue 12 | Vol 3 [Webinar Monthly Digest - Engineering360] [Webinar Monthly Digest - Engineering360] [Source Products]( | [Webinar Library]( | [Standards]( On-Demand Webinars [Choosing the Right Display for Your Product]( from Azumo When developing a product that requires a display, choosing the right display is key. But how do you select the right display for your application? In this webinar, Azumo discusses five different display technologies and analyzes 10 key considerations to help you decide the best display for your product. [Creating an Industrial Bridge: Moving Seamlessly Between Wired and Wireless Worlds]( from Richardson RFPD Attendees will learn how to securely bridge applications and solutions from the wired world to the wireless. [Next Generation CCUS Technologies and Disruptive Valve Actuation]( from Rotork plc This presentation aims to provide understanding of the relevant needs of this emerging market and how one form of actuation is presenting itself as a strategic progressive and disruptive solution. [Custom Grid Array: High-Density, Robust and Cost-Effective RF Performance for Medical Devices]( from Smiths Interconnect This webinar will discuss the current and emerging trends of miniaturization and more cost-effective solutions, and how this can be addressed using alternatives to traditional coax solutions. [Developing Optimized End-to-End Liquid Cooling Systems]( from Boyd Corporation Attendees will see design and manufacturing considerations for the development of highly efficient liquid cooling systems that fit design constraints while improving system performance and reliability. [Metal 3D Printing for Service Bureaus and Machine Shops]( from Desktop Metal Watch this webinar presentation to learn how metal 3D printing is helping machine shops and service bureaus optimize their operations by offering customers faster lead times and more design freedoms. [Shunt Resistors: New Approaches Obtain Higher Accuracy, Higher Power Density, More Robustness]( from Isabellenhutte USA In this webinar we will discuss new developments in the design and application of shunt resistors. Shunts are a widely used technology for current measurement. Future demands require more accuracy, higher-power densities and more robustness. We present new designs and application examples to make use of these. [Low Voltage MOSFETs: Products, Roadmap and Applications]( from WeEn Semiconductors (Hong Kong) Co., Limited In this webinar, we show the first products, the product roadmap for the near future and some key low voltage MOSFET applications. Important design considerations are also addressed. [Improving Testability for PCB Designers]( from Siemens Digital Industries Software In-circuit test and flying probe test considerations are typically made late in the PCB design process at which point any significant changes may be difficult to implement due to the knock-on effect this can incur. This webinar will show how to automate the analysis that can be performed during the PCB layout phase to ultimately deliver a more testable product to manufacturing, regardless of whether it will be produced in higher or lower production volumes. [Simply Sustainable Adhesive Tapes and the Performance Advantages They Provide]( from Mactac 100% solids adhesive coating technology offers many advantages versus the older solution-based coatings techniques used in specialty tapes. Not only can they lower costs, but they allow for the creation of product constructions that would not be possible with solution-based adhesives. These adhesives are cleaner with less regulatory concerns, lower energy consumption resulting in smaller carbon footprint, and with renewable raw materials many of these adhesives are now sustainable.   Upcoming Webinars [Simulation Driven Design for Electronics]( from Siemens Digital Industries Software — January 18, 2023 11:00AM EDT As a business leader, we know how vitally important it is for you to deliver the products your customers expect; there's so much at stake and many risks. The problem is that design teams can't keep up with all the product requirements changes and updates because they don't have the tools to see the impact of the changes, and they can't adapt and validate them fast enough. But that whole mess can be avoided by getting a high-level view of design performance using simulation and analysis earlier and often in the design process. The goal is to resolve problems early before they become significant. [Solving for Multiple Design Challenges with a Single Connection]( from TE Connectivity ™ — January 19, 2023 11:00AM EDT Attendees will learn how TE Connectivity's portfolio of connectors and heat shrink tubing products address the challenges engineers face when it comes to harsh environments, ergonomically friendly products, and safety standards. [System Level Thermal Design of Complex Multi-Layer Printed Circuit Boards]( from Siemens Digital Industries Software, Inc. — January 31, 2023 1:00PM EDT This webinar aims to demonstrate how a combined electro-thermal co-simulation as well as thermo-mechanical analyses of these boards using Siemens Simcenter products can improve the accuracy of the analyses and increase the productivity of the design teams. Connect with us: [Facebook]( [Twitter]( [Linkedin]( Feedback on this issue? [Tell us what you think]( Join our team of [Expert Contributors]( Engineering360 publishes more than 60 free industry newsletters - [browse our portfolio](. 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